Producenci
Winbond 629 dokumentacji
NO. | Symbol elementu | Rozmiar pliku | Stron | Opis dokumentacji | Producent |
---|---|---|---|---|---|
1. | (latch) | 104 KB | 16 | EPROM 64KX8 | Winbond |
2. | (latch) | 106 KB | 16 | EPROM 64KX8 | Winbond |
3. | -04 | 245 KB | 18 | 83.3MHz/100MHz Intel LX/EX Clock Gen. | Winbond |
4. | -04A | 245 KB | 18 | 83.3MHz/100MHz Intel LX/EX Clock Gen. | Winbond |
5. | -14A | 218 KB | 15 | 100MHz/150MHz Clock Gen., with S.S.T. | Winbond |
6. | -17A | 272 KB | 21 | 100MHz SiS 5595, 5598 Clock Gen. | Winbond |
7. | -39A | 277 KB | 21 | 100MHz/133 MHz Intel BX/ZX, VIA PC133 Clock Gen., 3-DIMM, with S.S.T. | Winbond |
8. | -58 | 267 KB | 19 | 100MHz/133MHz VIA MVP3, VIA Apollo Pro Clock Gen., 3-DIMM, with S.S.T. | Winbond |
9. | 075 | 975 KB | 30 | Single-Chip Voice Record/Playback Devices 60-, 75-, 90-, and 120-Second Durations | Winbond |
10. | 090 | 975 KB | 30 | Single-Chip Voice Record/Playback Devices 60-, 75-, 90-, and 120-Second Durations | Winbond |
11. | 120-4 | 975 KB | 30 | Single-Chip Voice Record/Playback Devices 60-, 75-, 90-, and 120-Second Durations | Winbond |
12. | 150 | 0.98 MB | 30 | Single-Chip Voice Record/Playback Devices 2-, 2.5-, 3-, and 4-Minute Durations | Winbond |
13. | 180 | 0.98 MB | 30 | Single-Chip Voice Record/Playback Devices 2-, 2.5-, 3-, and 4-Minute Durations | Winbond |
14. | 240 | 0.98 MB | 30 | Single-Chip Voice Record/Playback Devices 2-, 2.5-, 3-, and 4-Minute Durations | Winbond |
15. | Application brief | 220 KB | 4 | Technical Considerations for the Conversion from an ISD1000A Application to an ISD1400 | Winbond |
16. | Application brief | 53 KB | 1 | Using ISD Devices to Store and Send DTMF Tones | Winbond |
17. | Application brief | 165 KB | 3 | Using an ISD1100 in a Circuit Intended for an ISD1200 | Winbond |
18. | Application brief | 48 KB | 1 | Using the ISD1100/1200/1400 with External Clocking | Winbond |
19. | Application brief | 224 KB | 4 | ISD2500 Family Push-Button Operation M6 Mode | Winbond |
20. | Application brief | 165 KB | 3 | Using External Speaker Amplifiers with the ISD Single Chip Voice Record/Playback Devices | Winbond |
21. | Application brief | 61 KB | 1 | Automatic Power-Up Looping for the ISD1100, ISD1200, and ISD1400 Devices | Winbond |
22. | Application brief | 92 KB | 1 | Looping at Any Address Using the ISD1400 Device | Winbond |
23. | Application brief | 74 KB | 2 | Technical Considerations for the Conversion from an ISD1000A Application to an ISD2500 Application | Winbond |
24. | Application brief | 124 KB | 2 | Dividing the ISD1100, ISD1200, and ISD1400 Products into Fixed Message and ReRecordable Message Segments | Winbond |
25. | Application brief | 116 KB | 2 | Simple, Multiple Message ISD1400 Application with EOM Delete and Address Reset | Winbond |
26. | Application brief | 45 KB | 1 | Using the ISD-ES001 Evaluation System with ISD1100, ISD1200, and ISD1400 Products | Winbond |
27. | Application brief | 76 KB | 1 | Low Noise PC Board Layout Techniques for ISD Voice Record/Playback Devices | Winbond |
28. | Application brief | 97 KB | 2 | Non-Programmable Memory Cells | Winbond |
29. | Application brief | 296 KB | 2 | Reducing Noise in Designs with ISD Multilevel Storage Devices | Winbond |
30. | Application brief | 154 KB | 2 | ISD SOIC Package to be more Standard in Size | Winbond |
31. | Application brief | 78 KB | 3 | Single Transistor 3V Speaker Driver for the ISD4000 Series | Winbond |
32. | Application brief | 42 KB | 1 | Microphone Circuit Example for ISD4000 Series Devices | Winbond |
33. | Application brief | 50 KB | 1 | Minimum I/O for ISD Devices | Winbond |
34. | Application brief | 463 KB | 6 | Minimum I/O for ISD Devices | Winbond |
35. | Application brief | 24 KB | 1 | How the AUDOUT Pin Functions in the ISD33000 Products | Winbond |
36. | Application brief | 145 KB | 3 | Upgrading an ISD33000 Design to an ISD4000 Series Device | Winbond |
37. | Application brief | 98 KB | 3 | Upgrading an ISD33000 Design to an ISD4000 Series Device | Winbond |
38. | Application brief | 25 KB | 1 | Die Attaching ISD Products to PCB | Winbond |
39. | Application brief | 81 KB | 2 | Programming the ISD2532/40/48/64 Products in the ISDSD101 Programmer | Winbond |
40. | Application brief | 40 KB | 4 | The ISD Chipcorder Product Line: Sizes, Row Lengths and other useful details for addressable ISD products | Winbond |
41. | Application brief | 26 KB | 1 | Recorded pop elimination in the ISD4000 Series | Winbond |
42. | Application brief | 49 KB | 2 | ISD33000 vs. the ISD4000 | Winbond |
43. | Application brief | 37 KB | 4 | Automatic device detection of ISD33000 and ISD4000 Devices | Winbond |
44. | Application brief | 29 KB | 2 | Implementing a pause function in the ISD4000 device series | Winbond |
45. | Application note | 903 KB | 16 | Using the ISD33000 Devices with a Microcontroller | Winbond |
46. | Application note | 78 KB | 1 | Software Changes for the ISD5008/ISD5116 ChipCorder Products | Winbond |
47. | Application note | 1.07 MB | 5 | Using the Winbond ISD1810 Device with Electret Microphones | Winbond |
48. | Application note | 339 KB | 8 | Message Management in the ISD33000 Series | Winbond |
49. | Application note | 732 KB | 23 | Using the ISD33000 Device with Motorola Microcontrollers | Winbond |
50. | Application note | 86 KB | 6 | AGC Circuit for ISD4000 Series Devices | Winbond |
51. | Application note | 352 KB | 5 | The ISD4000 Series SPI Control Port Operations, a simplified guide. | Winbond |
52. | Application note | 1.21 MB | 17 | A "C" Language Source Code Example to Use with the ISD33000 Products | Winbond |
53. | Application note | 60 KB | 7 | Message management in Large Array ISD Devices | Winbond |
54. | Application note | 181 KB | 3 | ChipCorder Application Information Introduction | Winbond |
55. | Application note | 180 KB | 5 | ISD Products: Microphone and Speaker Selection | Winbond |
56. | Application note | 275 KB | 23 | ISD Products: Address Segmentation Resolution | Winbond |
57. | Application note | 70 KB | 2 | ISD Products: Frequently Asked Questions | Winbond |
58. | Application note | 332 KB | 9 | Stand Alone/Parallel Interface Products: Device Operation | Winbond |
59. | Application note | 499 KB | 13 | Stand Alone/Parallel Interface Products: Using the Device | Winbond |
60. | Application note | 199 KB | 6 | Stand Alone/Parallel Interface Products: Basic Addressing | Winbond |
61. | Application note | 502 KB | 10 | Stand Alone/Parallel Interface Products: Operational Modes | Winbond |
62. | Application note | 1.40 MB | 18 | Stand Alone/Parallel Interface Products: Circuit Examples for ISD1000A and ISD2500 Products | Winbond |
63. | Application note | 633 KB | 9 | Stand Alone/Parallel Interface Products: Circuit Examples for ISD1100, ISD1200, and ISD1400 Products | Winbond |
64. | Application note | 115 KB | 2 | Stand Alone/Parallel Interface Products: Good Audio Design Practices | Winbond |
65. | Application note | 338 KB | 4 | Stand Alone/Parallel Interface Products: Single-Chip Board Layout Diagrams | Winbond |
66. | Application note | 106 KB | 2 | Serial Interface Products: Introduction and Circuit Examples | Winbond |
67. | Application note | 80 KB | 1 | Serial Interface Products: Example Circuit: Minimum I/O Application | Winbond |
68. | Application note | 88 KB | 2 | Serial Interface Products: Example Circuit: Microphone Circuit | Winbond |
69. | Application note | 51 KB | 1 | Serial Interface Products: Example Circuit: Single Transistor 3-Volt Speaker Driver | Winbond |
70. | Application note | 163 KB | 3 | Serial Interface Products: Using the ISD33000 Series with 5-Volt Powered Processors | Winbond |
71. | Application note | 276 KB | 6 | Serial Interface Products: Operations, Tricks, and Techniques in the ISD33000 Series | Winbond |
72. | Application note | 735 KB | 16 | Serial Interface Products: Using the ISD33000 Device with a Microcontroller | Winbond |
73. | Application note | 510 KB | 23 | Serial Interface Products: Using the ISD33000 Device with a Low-Cost Motorola Microcontroller | Winbond |
74. | Application note | 244 KB | 8 | Serial Interface Products: Message Management in the ISD33000 Series | Winbond |
75. | Application note | 0.97 MB | 17 | Serial Interface Products: A 'C' Language Source Code Example to Use with the ISD33000 Series | Winbond |
76. | Application note | 340 KB | 6 | Serial Interface Products: AGC Circuit for the ISD33000 Series | Winbond |
77. | AT-12 | 132 KB | 10 | HIGH SPEED SRAM 64Kx16 | Winbond |
78. | BM29F040 | 143 KB | 29 | 5-Volt Flash 512Kx8 | Winbond |
79. | BM29F400B | 291 KB | 37 | 5-Volt Flash 256Kx16/512Kx8 | Winbond |
80. | BM29F400T | 291 KB | 37 | 5-Volt Flash 256Kx16/512Kx8 | Winbond |
81. | Development | 787 KB | 1 | ISD-ES001 Evaluation System | Winbond |
82. | Development | 110 KB | 2 | ISD-ES302 Demonstration Board | Winbond |
83. | Development | 259 KB | 2 | ISD-ES501 Evaluation System | Winbond |
84. | Development | 131 KB | 2 | ISD-ES502 Demonstration Board | Winbond |
85. | Development | 206 KB | 2 | ISD-ES511 and ISD-ES512 Evaluation/Development System | Winbond |
86. | General | 54 KB | 1 | DRAM Cross Reference | Winbond |
87. | General | 72 KB | 2 | EPROM Cross Reference | Winbond |
88. | General | 52 KB | 1 | Firmware Hub/Low Pin Count Flash Cross Reference | Winbond |
89. | General | 60 KB | 2 | High-Speed SRAM Cross Reference | Winbond |
90. | General | 69 KB | 5 | Low-Power SRAM Cross Reference (1 of 2) | Winbond |
91. | General | 66 KB | 4 | Low-Power SRAM Cross Reference (2 of 2) | Winbond |
92. | General | 61 KB | 3 | Flash Cross Reference | Winbond |
93. | General | 14 KB | 1 | Introduction | Winbond |
94. | General | 33 KB | 3 | Quality and Reliability Organization | Winbond |
95. | General | 47 KB | 3 | Quality Management | Winbond |
96. | General | 31 KB | 3 | Customer Return Handling Flow and Failure Analysis Procedure | Winbond |
97. | General | 256 KB | 22 | Process Related Reliability Test Data | Winbond |
98. | General | 108 KB | 10 | Package Related Reliability Test Data | Winbond |
99. | General | 49 KB | 5 | Average Outgoing Quality Data | Winbond |
100. | General | 322 KB | 27 | Device Reliability Test Data | Winbond |