Wyniki wyszukiwania: description
NO. | Symbol elementu | Rozmiar pliku | Stron | Opis dokumentacji | Producent |
---|---|---|---|---|---|
1. | DESCRIPTION | 51 KB | 3 | GENERAL DESCRIPTION/FEATURES | NJRC |
2. | DESCRIPTION | 47 KB | 1 | Technical Terms Explanation | NJRC |
3. | DESCRIPTION | 29 KB | 1 | Optoelectronics Semiconductor Elements | NJRC |
4. | Description | 2.67 MB | 178 | SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER | Renesas |
5. | Description | 2.49 MB | 166 | SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER | Renesas |
6. | C505C | 824 KB | 88 | General Description: The C505C enhances the C500 family of 8-bit Microcontrollers by a new member which provides full CAN version 2.0 B integrated on-chip. The C505C meets the current requirements for increasingly small controllers with high performance, | Infineon |
7. | Others | 57 KB | 1 | Product Description | Infineon |
8. | Package | 199 KB | 2 | TSLP package description | Infineon |
9. | dsPIC30F | 452 KB | 28 | Instruction Set Description - Advance Information | Microchip |
10. | DSP56000FMA2 | 198 KB | 40 | DSP56000 Appendix A (cont): Instruction Descriptions (DIV-JScc) | Motorola |
11. | DSP56000FMA3 | 252 KB | 50 | DSP56000 Appendix A (cont): Instruction Descriptions (JSCLR-R) | Motorola |
12. | DSP56000FMA4 | 303 KB | 60 | DSP56000 Appendix A (cont): Instruction Descriptions (U-MPY) | Motorola |
13. | DSP56000FMA5 | 149 KB | 30 | DSP56000 Appendix A (cont): Instruction Descriptions (MPYR-RND) | Motorola |
14. | MC68HC05P4A | 931 KB | 102 | MC68HC05P4A Advance Information Description | Motorola |
15. | AN-998 | 125 KB | 8 | Functional Description and Specification of the PCM16C02 PC Card Interface Device in Rev 3 DMA Mode | National Semiconductor |
16. | CS5210-1 | 61 KB | 8 | 10A LDO 3-Pin Adjustable Linear RegulatorDescription | ON Semiconductor |
17. | AN179 | 102 KB | 6 | Circuit Description Of The NE564 | Philips |
18. | AN96072_1 | 876 KB | 37 | Application and product Description of the TDA6107Q-N1 video output amplifier | Philips |
19. | S5N8946 | 141 KB | 28 | ADSL/CABLE MODEM MCU Description | Samsung |
20. | S5N8946 | 117 KB | 32 | ADSL/CABLE MODEM MCU Evaluation Board Descriptions | Samsung |
21. | AN1082 | 182 KB | 35 | ST7 - DESCRIPTION OF THE ST72141 MOTOR CONTROL PERIPHERAL REGISTERS | STMicroelectronics |
22. | AN1235 | 86 KB | 8 | FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE | STMicroelectronics |
23. | AN677 | 182 KB | 14 | ST6 - PAINLESS MICROCONTROLLER CODE BY GRAPHICAL APPLICATION DESCRIPTION | STMicroelectronics |
24. | AN2091 | 4.65 MB | 15 | CRX14 vs Short Range Contactless Memory: Description of the I¿C Bus Commands | STMicroelectronics |
25. | M14C16_DD | 15 KB | 2 | M14C16 DIE DESCRIPTION | STMicroelectronics |
26. | M14C32_DD | 17 KB | 2 | M14C32 DIE DESCRIPTION | STMicroelectronics |
27. | AN2031 | 191 KB | 12 | STA308-508 Evaluation Board Description | STMicroelectronics |
28. | Datasheet | 710 KB | 68 | XC4000E/EX/XL FPGAs: Description | Xilinx |
29. | Datasheet | 469 KB | 45 | Spartan-II: Detailed Functional Description | Xilinx |
30. | Datasheet | 214 KB | 20 | Virtex: Detailed Functional Description | Xilinx |
31. | Datasheet | 142 KB | 14 | XC4000XLA: Description | Xilinx |
32. | Datasheet | 780 KB | 52 | Virtex-E: Detailed Functional Description | Xilinx |
33. | Datasheet | 781 KB | 50 | Virtex-E Extended Memory: Detailed Functional Description | Xilinx |
34. | Datasheet | 552 KB | 39 | Virtex-II: Detailed Functional Description | Xilinx |
35. | Datasheet | 323 KB | 19 | Spartan-IIE: Detailed Functional Description | Xilinx |
36. | ZXF36L01W24 | 832 KB | 12 | VARIABLE Q FILTER DESCRIPTION | Zetex |
37. | AN2355 | 1.13 MB | 56 | Sensorless BLDC Motor Control on MC68HC908MR32 Software Description | Freescale |
38. | AN2550 | 323 KB | 6 | MC68SZ328 Detailed Errata and Workaround Description of SDRAMC Self-Refresh Entry Problem | Freescale |
39. | AN1353 | 137 KB | 17 | ST6200C SOFTWARE DESCRIPTION FOR COOLING THERMOSTAT APPLICATION | STMicroelectronics |
40. | AN1714 | 1.12 MB | 42 | ST7538 FSK POWER-LINE TRANSCEIVER DEMO-KIT DESCRIPTION | STMicroelectronics |
41. | M306V8FJFP | 3.11 MB | 365 | SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER DESCRIPTION | Renesas |
42. | MS-521 | 85 KB | 6 | VHC Description and Family Characteristics | Fairchild |
43. | MS-532 | 199 KB | 2 | GTLP Description and Family Characteristics | Fairchild |
44. | MS-533 | 14 KB | 2 | GTLP Extended Characterization Data - Description of Parameters | Fairchild |
45. | MS-538 | 87 KB | 7 | ABT Description and Family Characteristics | Fairchild |
46. | MS-547 | 212 KB | 2 | LVDS Description and Family Characteristics | Fairchild |
47. | CB-1 | 58 KB | 2 | SIO Input/Output Register Description | National Semiconductor |
48. | EE-133 | 268 KB | 18 | Converting From Legacy Architecture Files To Linker Description Files for the ADSP-218x | Analog Devices |
49. | EE-69 | 32 KB | 4 | Understanding and Using Linker Description Files | Analog Devices |
50. | 80c51 | 153 KB | 24 | 80C51 Family Hardware Description | Philips |
51. | Secure | 41 KB | 2 | AT90SC6464C Summary , This document gives the key features, a brief description and a block diagram. The Complete datasheet is available under Non-Disclosure Agreement. | Atmel |
52. | Related | 53 KB | 3 | Infrared receiver modules: Technical Note - Circuit Description of the IR Receiving Modules | Vishay |
53. | ASICs | 108 KB | 9 | Test Vector Compression by RTZ/RTO Formatting , The purpose of this Application Note is to explain how CBIC test vectors can be compressed by changing some pin formats into RTZ (Return-to-Zero) or RTO (Return-to-One. In addition, a description of rules w | Atmel |
54. | ROM | 115 KB | 2 | Voyager Emulation Platform (ATV1) Summary , This document gives the key features, a brief description and an illustration. The Complete datasheet is available under Non-Disclosure Agreement. | Atmel |
55. | ROM | 37 KB | 2 | AT90SC6432R Summary , This document gives the key features, a brief description and a block diagram. The Complete datasheet is available under Non-Disclosure Agreement. | Atmel |
56. | intruptsys | 28 KB | 6 | Functional description of Philips arbitrating interrupt systems | Philips |
57. | M14C04 | 12 KB | 2 | M14C04 Die Description | STMicroelectronics |
58. | FingerChip | 31 KB | 6 | Application note 11: Fingerprint database description | Atmel |
59. | Related | 65 KB | 2 | Optocouplers: Technical Note - General Description | Vishay |
60. | DSP | 396 KB | 36 | Client Side Telephony (CST) Chip Flex Mode Flex Examples Description | Texas Instruments |
61. | MPU | 225 KB | 27 | E6000/E8000 Emulator HS6000ELN01H (Description Notes on Using LAN Adapter) | Renesas |
62. | MPU | 15 KB | 2 | Supplemental Description of DMAC for the M16C/60, M16C/61 and M16C/62 Group MCUs | Renesas |
63. | MPU | 46 KB | 4 | Supplemental Description for WAIT Peripheral Function Clock Stop Bit | Renesas |
64. | MPU | 229 KB | 23 | E6000/E8000 Emulator HS6000EIU02H (Description Notes on Using USB Adapter) | Renesas |
65. | MPU | 47 KB | 3 | Description about the duty-cycle when using Timer TOU in PWM output mode | Renesas |
66. | MPU | 63 KB | 2 | Correction of the Description in the H8S/2339F E10A Emulator Users Manual | Renesas |
67. | MPU | 64 KB | 2 | Correction of the Description in the H8/3664F E10T Emulator Users Manual | Renesas |
68. | MPU | 235 KB | 13 | The description on the DMAC block transfer mode by aUSB request is corrected and added in the H8S/2215 Group and the H8S/2218, H8S/2212 Group manuals | Renesas |
69. | MPU | 59 KB | 2 | The limitation of exception handing routine description | Renesas |
70. | MPU | 20 KB | 1 | Revision of BCR1 description | Renesas |
71. | MPU | 328 KB | 11 | Correction of errors on SH7727 hardware manual (Pin Description) | Renesas |
72. | Application Note | 588 KB | 33 | AT89 Series Hardware Description | Atmel |
73. | Application Notes | 248 KB | 10 | PROFET Functional Description | Infineon |
74. | Application Notes | 141 KB | 11 | Device description BSP 75 , BSP 75 A | Infineon |
75. | Application Notes | 367 KB | 20 | Device description TLE62x0 | Infineon |
76. | Application Notes | 92 KB | 5 | TEMPFET - Functional Description | Infineon |
77. | Application Notes | 64 KB | 9 | HITFET - Second Generation Functional Description and Application Notes | Infineon |
78. | Development Tools | 1.45 MB | 124 | EASY22554 Tool Description | Infineon |
79. | Development Tools | 0.96 MB | 94 | PEB 2255 - EASY2255-r1 Tool Description | Infineon |
80. | Development Tools | 1.58 MB | 128 | EASY2256 Tool Description | Infineon |
81. | Development Tools | 4.10 MB | 370 | EASY3445 Tool Description | Infineon |
82. | Development Tools | 147 KB | 18 | EASY3452 Tool Description | Infineon |
83. | Development Tools | 1.85 MB | - | EASY4220-R2 Tool Description | Infineon |
84. | Development Tools | 1.13 MB | 80 | EASY954 Tool Description | Infineon |
85. | Development Tools | 7.41 MB | 302 | EASY256 - Tool Description | Infineon |
86. | Development Tools | 6.87 MB | 246 | EASY256, E1/T1 Reference Design, Tool Description | Infineon |
87. | Development Tools | 6.72 MB | 286 | EASY324-R2 Tool Description | Infineon |
88. | Development Tools | 209 KB | 2 | SAF C165 UTAH Evaluation Board: Tool description | Infineon |
89. | Development Tools | 468 KB | 2 | GMR Starter Kit description | Infineon |
90. | Development Tools | 858 KB | 28 | ACE Demo Car-Kit Tool Description - SEK 2172 | Infineon |
91. | Application note | 6.06 MB | 70 | The TMS320C30 Applications Board Functional Description ( Contains Scanned Text) | Texas Instruments |
92. | Application Note | 95 KB | 4 | DESCRIPTION OF FLASH MEMORIES | Sharp |
93. | Data Sheets | 131 KB | 13 | ispLSI 1000EA Family Architectural Description | Lattice |
94. | Data Sheets | 135 KB | 11 | ispLSI 2000E, 2000/A, 2000VL, 2000VE and 2000V Family Architectural Description | Lattice |
95. | Data Sheets | 58 KB | 7 | ispLSI 5000V Family Architectural Description | Lattice |
96. | Data Sheets | 154 KB | 7 | ispLSI 8000 and 8000V Family Architectural Description | Lattice |
97. | Data Sheets | 41 KB | 3 | ispGDXV, ispGDX and ispGDS Architectural Description | Lattice |
98. | Data Sheets | 47 KB | 4 | ispMACH 4A Family Architectural Description | Lattice |
99. | Application Note | 1.02 MB | 50 | AN96018: Application and Product Description of the 16:9 Compressor SAA4981/T | Philips |
100. | Application Note | 435 KB | 39 | 8XC51RA/RB/RC Hardware Description | Intel |
101. | Application Note | 336 KB | 24 | 83C51KB Hardware Description | Intel |
102. | Application Note | 1.04 MB | 159 | AP-733 Switched Ethernet Reference Design Description | Intel |
103. | Application Note | 118 KB | 18 | 8xC251TA, 8xC251TB, 8xC251TP, 8xC251TQ, Hardware Description | Intel |
104. | Application Note | 62 KB | 10 | SCKE Circuit Description for the Intel 80303 I/O Processor and the Intel 80312 I/O Companion Chip | Intel |
105. | Application Note | 54 KB | 11 | Architectural Description of Embedded Signal Processors and DSP Algorithm Implementation | Intel |
106. | 2SD1911 | 103 KB | 1 | Silicon Diffused Power Transistor(GENERAL DESCRIPTION) | Wing Shing Computer Components |