Wyniki wyszukiwania: outline
| NO. | Symbol elementu | Rozmiar pliku | Stron | Opis dokumentacji | Producent |
|---|---|---|---|---|---|
| 1. | OUTLINE |
144 KB |
6 | Ceramic Small Outline Package (CSOP) | National Semiconductor |
| 2. | OUTLINE |
236 KB |
7 | Transistor Outline (TO-202) | National Semiconductor |
| 3. | OUTLINE |
78 KB |
3 | Transistor Outline (TO-226) | National Semiconductor |
| 4. | OUTLINE |
74 KB |
3 | Transistor Outline (TO-237) | National Semiconductor |
| 5. | outlines |
180 KB |
26 | HEF Package Outlines/Info, The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC | Philips |
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| 6. | outlines |
171 KB |
23 | HC/T Package Outlines, The IC06 74HC/HCT/HCMOS Logic Package Outlines | Philips |
| 7. | outlines |
75 KB |
10 | Thyristors and Triacs Mechanical Data | Philips |
| 8. | Outlines |
121 KB |
6 | Ceramic Quad Flat Pack L Leaded (CQFPL) Package Outlines | Atmel |
| 9. | Outlines |
161 KB |
6 | Ceramic Quad Flat Pack J Leaded (CQFPJ) Package Outlines | Atmel |
| 10. | Outlines |
90 KB |
4 | Flat Pack Package Outlines | Atmel |
| 11. | Outlines |
287 KB |
13 | Multilayer Quad Flat Pack (MQFP) Package Outlines | Atmel |
| 12. | Outlines |
393 KB |
12 | Ceramic Pin Grid Array (PGA) Package Outlines | Atmel |
| 13. | Outlines |
140 KB |
8 | Side Braze Package Outlines | Atmel |
| 14. | Package |
59 KB |
1 | Package Outline Dimension | Infineon |
| 15. | Package |
160 KB |
12 | Package Outlines | Infineon |
| 16. | Package |
205 KB |
6 | Package Outlines 1 | Infineon |
| 17. | Package |
32 KB |
1 | TSLP-2 outline | Infineon |
| 18. | SFH6720 |
418 KB |
6 | 8 Pin, High-Speed 5.0 Mb/s Optocoupler, Small Outline Surface Mount | Infineon |
| 19. | SFH6721 |
418 KB |
6 | 8 Pin, High-Speed 5.0 Mb/s Optocoupler, Small Outline Surface Mount | Infineon |
| 20. | MC68060CO |
40 KB |
1 | MC68060ZU 304-TBGA Package Dimensions Case Outline 1137B-01 | Motorola |
| 21. | CS8321 |
146 KB |
6 | Micropower 5V, 150mA Low DropoutLinear Regulator | ON Semiconductor |
| 22. | CS8101 |
128 KB |
13 | Micropower 5V, 100mA Low DropoutLinear Regulator with RESETbar and ENABLEbar | ON Semiconductor |
| 23. | CASERM |
4.56 MB |
186 | Case Outline and Packaging Reference Manual | ON Semiconductor |
| 24. | AN1321 |
300 KB |
8 | Application Note: Brushless DC Motor Drive Incorporates Small Outline Integrated Circuit Packaged MOSFETs | ON Semiconductor |
| 25. | LC33832M-10 |
356 KB |
9 | Small outline package version of the LC33832S | Sanyo |
| 26. | LC33832M-70 |
356 KB |
9 | Small outline package version of the LC33832S | Sanyo |
| 27. | LC33832M-80 |
356 KB |
9 | Small outline package version of the LC33832S | Sanyo |
| 28. | LC33832ML-10 |
356 KB |
9 | Small outline package version of the LC33832SL | Sanyo |
| 29. | LC33832ML-70 |
356 KB |
9 | Small outline package version of the LC33832SL | Sanyo |
| 30. | LC33832ML-80 |
356 KB |
9 | Small outline package version of the LC33832SL | Sanyo |
| 31. | LC3564BT-10 |
135 KB |
9 | Thin small outline package version of the LC3564B | Sanyo |
| 32. | LC3564BT-70 |
135 KB |
9 | Thin small outline package version of the LC3564B | Sanyo |
| 33. | LC3564BT |
135 KB |
9 | Thin small outline package version of the LC3564B | Sanyo |
| 34. | General |
680 KB |
20 | PACKAGE OUTLINES | Sharp |
| 35. | General |
1.05 MB |
31 | PACKAGE OUTLINES | Sharp |
| 36. | General |
850 KB |
22 | PACKAGE OUTLINES | Sharp |
| 37. | General |
173 KB |
4 | PACKAGE OUTLINES | Sharp |
| 38. | AN2388 |
358 KB |
12 | Heatsink Small Outline Package (HSOP) | Freescale |
| 39. | AN2409 |
504 KB |
12 | Small Outline Integrated Circuit - Fine Pitch Package (SOIC) | Freescale |
| 40. | EA61FC4-F |
36 KB |
2 | Outline Drawing | Nihon Inter Electronics |
| 41. | Packaging |
2.05 MB |
66 | Packaging - Outlines and Parameters | Microchip |
| 42. | ic01 |
359 KB |
42 | Package information Package outlines | Philips |
| 43. | ic03 |
358 KB |
35 | Package information Package outlines | Philips |
| 44. | ic12 |
183 KB |
23 | Package information Package outlines | Philips |
| 45. | ic16 |
70 KB |
11 | Package information Package outlines | Philips |
| 46. | ic18 |
380 KB |
32 | Package outlines Package information | Philips |
| 47. | ic22 |
331 KB |
39 | Package information Package outlines | Philips |
| 48. | sc01 |
112 KB |
16 | PACKAGE OUTLINES | Philips |
| 49. | sc05 |
108 KB |
12 | Package outlines Video Transistors and Modules for Monitors | Philips |
| 50. | sc06 |
53 KB |
9 | PACKAGE OUTLINES | Philips |
| 51. | sc07 |
115 KB |
14 | Package outlines Small-signal Field-effect Transistors and Diodes | Philips |
| 52. | sc07 |
58 KB |
7 | Package outlines Small-signal field-effect transistors | Philips |
| 53. | sc11 |
227 KB |
29 | Package Outlines Power diodes | Philips |
| 54. | sc13 |
132 KB |
23 | Package outlines | Philips |
| 55. | sc13 |
188 KB |
24 | Package outlines PowerMOS transistors | Philips |
| 56. | sc14 |
107 KB |
19 | RF Wideband Transistors Package outlines | Philips |
| 57. | sc16 |
80 KB |
10 | Package outlines Wideband hybrid amplifier modules | Philips |
| 58. | sc19 |
273 KB |
49 | Package outlines RF & Microwave Power Transistors and RF Power Modules | Philips |
| 59. | CLGA |
135 KB |
3 | Ceramic Land Grid Array Package Outlines | Atmel |
| 60. | Package |
53 KB |
2 | JEDEC Part Number: Outline is consistent with JEDEC MO229-VEED-2 | Vishay |
| 61. | PACKAGING |
23 KB |
1 | Thin Shrink Small Outline TSSOP Package Code: Z (8 pin, 14 pin) | ISSI |
| 62. | MPU |
227 KB |
22 | Outline of CAN Module | Renesas |
| 63. | Application note |
316 KB |
45 | Thin Very Small-Outline Package (TVSOP) Application Report | Texas Instruments |
| 64. | Application Note |
81 KB |
21 | AN96017: Outline specification CCA210S microcontroller for a CD/Radio/Cassette recorder system | Philips |
| 65. | Application Note |
70 KB |
18 | AN96020: Outline Specification CPR120S, microcontroller for a Portable Radio system. V1.0 | Philips |
| 66. | Application Note |
2.09 MB |
156 | Small Outline Package Guide | Intel |
| 67. | 21-0117G |
31 KB |
2 | PACKAGEOUTLINE/2x2UCSP | MAXIM - Dallas Semiconductor |
| 68. | MK2761A |
153 KB |
6 | Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) | Integrated Circuit Systems |
| 69. | SM3257EN |
153 KB |
1 | QFN-40 Package Outline | SiliconMotion |